发明名称 |
Reducing Source/Drain Resistance of III-V Based Transistors |
摘要 |
An integrated circuit structure includes a substrate; a channel layer over the substrate, wherein the channel layer is formed of a first III-V compound semiconductor material; a highly doped semiconductor layer over the channel layer; a gate dielectric penetrating through and contacting a sidewall of the highly doped semiconductor layer; and a gate electrode on a bottom portion of the gate dielectric. The gate dielectric includes a sidewall portion on a sidewall of the gate electrode.
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申请公布号 |
US2013248929(A1) |
申请公布日期 |
2013.09.26 |
申请号 |
US201313873767 |
申请日期 |
2013.04.30 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
KO CHIH-HSIN;WANN CLEMENT HSINGJEN |
分类号 |
H01L29/78;H01L21/22 |
主分类号 |
H01L29/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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