发明名称 Reducing Source/Drain Resistance of III-V Based Transistors
摘要 An integrated circuit structure includes a substrate; a channel layer over the substrate, wherein the channel layer is formed of a first III-V compound semiconductor material; a highly doped semiconductor layer over the channel layer; a gate dielectric penetrating through and contacting a sidewall of the highly doped semiconductor layer; and a gate electrode on a bottom portion of the gate dielectric. The gate dielectric includes a sidewall portion on a sidewall of the gate electrode.
申请公布号 US2013248929(A1) 申请公布日期 2013.09.26
申请号 US201313873767 申请日期 2013.04.30
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 KO CHIH-HSIN;WANN CLEMENT HSINGJEN
分类号 H01L29/78;H01L21/22 主分类号 H01L29/78
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