发明名称 PATTERN FORMATION METHOD, PATTERN FORMATION DEVICE, AND DEVICE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To form a target pattern in a shot area on a wafer in high accuracy.SOLUTION: In forming a target pattern in a shot area on a wafer by stitching light patterns generated by a variable shape forming mask, a plurality of templates that specify use areas of the variable shape forming mask are set respectively in a state where an overlapping area partly occurs (step 102 to step 108). On the basis of information concerning setting of each template and information concerning a target pattern, a plurality of modulation elements of the variable shape forming mask are sequentially controlled (step 110). Thereby, it becomes possible to form a target pattern in the shot area of the wafer in high accuracy.
申请公布号 JP2013191901(A) 申请公布日期 2013.09.26
申请号 JP20130141448 申请日期 2013.07.05
申请人 NIKON CORP 发明人 YAMATO SOICHI;HIRUKAWA SHIGERU
分类号 H01L21/027 主分类号 H01L21/027
代理机构 代理人
主权项
地址