发明名称 |
PROCESS TREATMENT PART, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD USING PROCESS TREATMENT PART AND SUBSTRATE PROCESSING APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which uniformly processes substrates.SOLUTION: A substrate processing apparatus of this invention includes: an internal chamber where a first space is formed therein; a first external chamber which encloses the internal chamber and forms a second space separated from the first space; a susceptor which is positioned in the first space and supports a substrate; a first exhaust line which is connected with the internal chamber and exhausts a gas in the first space to the exterior; a process gas supply part supplying a process gas used for processing the substrate to the first space; and a monitor module which is positioned in the second space and monitors the state of the first space. |
申请公布号 |
JP2013191845(A) |
申请公布日期 |
2013.09.26 |
申请号 |
JP20130046993 |
申请日期 |
2013.03.08 |
申请人 |
PSK INC |
发明人 |
CHOI HYE SUN;LEE SEON WOO |
分类号 |
H01L21/3065 |
主分类号 |
H01L21/3065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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