发明名称 PROCESS TREATMENT PART, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD USING PROCESS TREATMENT PART AND SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which uniformly processes substrates.SOLUTION: A substrate processing apparatus of this invention includes: an internal chamber where a first space is formed therein; a first external chamber which encloses the internal chamber and forms a second space separated from the first space; a susceptor which is positioned in the first space and supports a substrate; a first exhaust line which is connected with the internal chamber and exhausts a gas in the first space to the exterior; a process gas supply part supplying a process gas used for processing the substrate to the first space; and a monitor module which is positioned in the second space and monitors the state of the first space.
申请公布号 JP2013191845(A) 申请公布日期 2013.09.26
申请号 JP20130046993 申请日期 2013.03.08
申请人 PSK INC 发明人 CHOI HYE SUN;LEE SEON WOO
分类号 H01L21/3065 主分类号 H01L21/3065
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