发明名称 Solder powder for connecting components made of aluminum alloy, comprises powder particles based on aluminum-silicon, where uniformly distributed primary-crystalline silicon precipitates in an eutectic aluminum silicon alloy microstructure
摘要 <p>Solder powder for connecting components made of aluminum or aluminum alloy by hard soldering, comprises powder particles based on aluminum-silicon with greater than 12 wt.% silicon, where the powder particles are generated by a rapid solidification and uniformly distributed primary-crystalline silicon precipitates in an eutectic aluminum silicon-alloy microstructure. Independent claims are also included for: (1) a heat exchanger for components made of aluminum or an aluminum alloy, comprising extruded flat tube profiles, lamellae, which are arranged between the flat tube profiles, and collector profiles, in which the flat tube ends are inserted profiles, where the flat tube profiles are coated with a solder powder; and (2) dry mixture for coating the heat exchanger components for hard soldering, comprising a mixture, which comprises 20-40 wt.% solder powder, 25-60 wt.% fluxing agent powder, and optionally 20 wt.% binder powder.</p>
申请公布号 DE102012006121(A1) 申请公布日期 2013.09.26
申请号 DE20121006121 申请日期 2012.03.26
申请人 ERBSLOEH ALUMINIUM GMBH 发明人 SUCKE, NORBERT-WILLIAM;LOECHTE, LOTHAR;GRZESIK, MARTIN
分类号 B23K1/00;B23K1/20;B23K35/14;B23K35/24;F28F9/18;F28F21/08 主分类号 B23K1/00
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