METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

摘要

Provided is a method for manufacturing an electronic component capable of minimizing damage to a substrate, solder ball remnants, and formation of defective fillets even when mounting an electronic element on a printed circuit board employing a substrate with a low melting point such as (PET) and (PEN) by irradiating the rear surface of the substrate with near-infrared laser light. The method for manufacturing an electronic component according to the present invention mounts an electronic element on a printed circuit board which has a substrate made of a resin with a melting point of 280 °C or less and a wiring pattern on the substrate. The method comprises: a step of supplying solder; a placement step of placing the terminal of the electronic element; and a step of soldering the electronic element onto the printed circuit board by near-infrared laser light irradiation. In the placement step, the width of the wiring pattern is set to be 2 mm or less within the range of at least 2 mm in both extending directions of the wiring pattern from the center of the width of the terminal, and the shortest distance from one end in the width direction of the wiring pattern to the terminal is set to be 0.5 mm to 1.6 mm.