| 摘要 |
<p>PURPOSE: A bonding inspecting apparatus for a flip chip assembly and an inspecting method thereof are provided to accurately photograph an image without distortion by elastically supporting a substrate to be slid through a film backup jig. CONSTITUTION: A film backup jig (50) supports the bottom of a film type substrate to be slid. A photographing unit photographs the film type substrate with a semiconductor device which is soldered through a penetration hole which is formed on the film backup jig. The photographing unit includes an optical reflection unit (11), a lens part (13), and a CCD camera (15). A position adjusting unit supports the photographing unit to move on X-Y planes and ascend and descent in a Z axis. The position adjusting unit includes first to third LM blocks (33a,35a,37a) which grip the outer circumference of a barrel (13a) and first to third LM guides (33b,35b,37b). A control unit (70) checks a defect by comparing the image photographed by the photographing unit with a preset reference image. [Reference numerals] (70) Control unit</p> |
