WIRING BASE PLATE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A wiring base plate and a method for manufacturing the same are provided to prevent an increase in the resistance of a wiring path by selectively removing a seed layer for covering a conductive part. CONSTITUTION: A conductive part (24) extends the inside of an insulating layer. The conductive part is formed on the cross section of the insulating layer. A seed layer is formed on the surface of the insulating layer. The seed layer includes an opening part formed in the cross section. A wiring path (34) is made of a conductive material deposited on the seed layer and the opening part.