发明名称 SOFT SPUTTERING MAGNETRON SYSTEM
摘要 A sputtering method and apparatus having at least one set of dual rotatable cylindrical sputtering targets mounted in a vacuum chamber. Magnet assemblies in hollow target cylinders provide erosion zones running long the parallel sides of a racetrack that act as target flux sources towards a substrate. These parallel erosion zones have a highly concentrated plasma density for rapid sputtering of the target and any reactive material. Features include the angular distance between normals to adjacent parallel erosion zones, the angle greater than 45° subtended at the center of the cylindrical target, placement of the substrate with respect to the targets, and pointing angles (orientation or tilt) of the racetracks toward the substrate and/or each other. These parameters form a relatively wide and efficient constant flux deposition region at the substrate, and allows for high deposition rates at constant reactive gas partial pressures with substantially uniform film stoichiometry and thickness.
申请公布号 EP2640865(A1) 申请公布日期 2013.09.25
申请号 EP20110826114 申请日期 2011.11.17
申请人 SOLERAS ADVANCED COATINGS BVBA 发明人 DE BOSSCHER, WILMERT
分类号 C23C14/35;H01J37/34 主分类号 C23C14/35
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