发明名称 |
Integrated circuit packaging system with via and method of manufacture thereof |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a stacking carrier having a cavity; placing a base integrated circuit in the cavity, the base integrated circuit having a base interconnect facing the cavity; mounting a stack integrated circuit to the base integrated circuit; and picking the stack integrated circuit mounted to the base integrated circuit out of the stacking carrier.
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申请公布号 |
US8541886(B2) |
申请公布日期 |
2013.09.24 |
申请号 |
US20100720667 |
申请日期 |
2010.03.09 |
申请人 |
CHIN CHEE KEONG;STATS CHIPPAC LTD. |
发明人 |
CHIN CHEE KEONG |
分类号 |
H01L29/40;H01L23/02;H01L23/495 |
主分类号 |
H01L29/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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