MANUFACTURING METHOD OF BACK LIGHT WITH PRINTED CIRCUIT OF FILM TYPE AND BACK LIGHT UNIT DEVICE THEREOF

摘要

PURPOSE: A method for manufacturing a back light (BL) in a printed circuit phototool bonding mode and a back light unit (BLU) device using the same are provided to remove a plurality of wire connectors, thereby reducing the overall weight. CONSTITUTION: An optical scattering pattern is formed on the top surface of a reflector (65). A light guide plate is formed in the upper part of the optical scattering pattern. Heat dissipation bases (10) support the reflector. A printed circuit phototool (30) comprises light emitting diode chips (60). The LED chips are bonded to the inside of the heat dissipation bases.