发明名称 |
Bonding method, bonding apparatus, and manufacturing method of semiconductor device using the same |
摘要 |
Provided is a bonding apparatus capable of forming even loops at high speed. According to a bonding apparatus 1, a capillary 5 is lowered to a bonding position to bond an initial ball 10 to a pad 104 on an overhanging die 100. Here, a position of the capillary 5 in a Z direction and a load detected by a load sensor 7 are detected and stored every predetermined time period. A load change point is detected by referring to the stored load and the stored position. By subtracting the bonding position from a load changing position of the capillary 5 at the load change point, a movement amount Z of the capillary 5 from the load changing position to the bonding position is calculated. After the capillary 5 is lifted by the movement amount Z, a wire loop is formed between the pad 104 and a lead 105.
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申请公布号 |
US8540135(B2) |
申请公布日期 |
2013.09.24 |
申请号 |
US201113044834 |
申请日期 |
2011.03.10 |
申请人 |
AOYAGI NOBUYUKI;YOSHINO HIROAKI;SHINKAWA LTD. |
发明人 |
AOYAGI NOBUYUKI;YOSHINO HIROAKI |
分类号 |
B23K20/00;B23K20/10;B23K31/02 |
主分类号 |
B23K20/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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