发明名称 |
Semiconductor molding chamber |
摘要 |
A system and method for a semiconductor molding chamber is disclosed. An embodiment comprises a top molding portion and a bottom molding portion that form a cavity between them into which a semiconductor wafer is placed. The semiconductor molding chamber has a first set of vacuum tubes which hold and fix the position of the semiconductor wafer and a second set of vacuum tubes which evacuate the cavity of extraneous ambient gasses. The encapsulant may then be placed over the semiconductor wafer in order to encapsulate the semiconductor wafer. |
申请公布号 |
US8540506(B2) |
申请公布日期 |
2013.09.24 |
申请号 |
US20100857245 |
申请日期 |
2010.08.16 |
申请人 |
LIN JING-CHENG;CHIOU WEN-CHIH;JENG SHIN-PUU;YU CHEN-HUA;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
LIN JING-CHENG;CHIOU WEN-CHIH;JENG SHIN-PUU;YU CHEN-HUA |
分类号 |
H01L21/56 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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