| 摘要 |
PURPOSE: A solder resist composition is provided to form a solder resist opening part with a size of 50 micrometers or less, to improve processing ability of a laser, and to reduce laser power. CONSTITUTION: A solder resist composition comprises 100 parts by weight of epoxy base material, 50-80 parts by weight of curing accelerator, 2-7 parts by weight of curing accelerator, and 10-50 parts by weight of diluting agent based on a tetrahydrophtalic unhydride hardener. The epoxy base material is one or more selected from a compound indicated in chemical formula 1-3. In the chemical formula 1-3, n is an integer from 1-10. |
