| 摘要 |
PROBLEM TO BE SOLVED: To provide a formation method of a solder bump which forms solder bumps having sufficient heights with a simple method.SOLUTION: In a formation method of a solder bump of this invention, solder bumps 3 are respectively formed on multiple electrode pads 12 formed on a surface of a wiring board 1. The formation method of the solder bump includes: a temporary resist film formation process where a temporary resist film 2, in which openings corresponding to the electrode pads 12 are provided, is formed on the wiring board 1; a solder filling process where melting solder is poured into the openings to form the solder bumps 3; and a temporary resist film peeling process where the temporary resist film 2 is peeled from the wiring board 1. |
