POLYIMIDE PRECURSOR VARNISH AND POLYIMIDE RESIN, AND USE THEREOF

摘要

Provided are a polyimide precursor varnish and polyimide resin that are capable of providing a material having excellent insulating performance and mechanical strength, and further, both heat resistance and low water absorbency; also provided is a use for the same. This polyimide precursor varnish is formed from a composition comprising a polyimide precursor and a solvent. In the case of a polyimide film in which the composition is coated on a film and heat treated for one hour at 300ºC under a nitrogen atmosphere with the temperature elevation rate being 5º/min, and the film thickness is 20 to 60 µm after drying, the polyimide film has a glass transition temperature of 290ºC or higher, a coefficient of water absorption of 2.0% or less, and a tensile elongation at break of 55% or greater.