| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly-reliable semiconductor sensor which reduces resin burrs generated at a light-incidence surface of a light-receiving element at the time of element manufacturing; evens out variation in output characteristics at sensor body parts among element to improve yield; and obtains stable output characteristics.SOLUTION: A semiconductor sensor manufacturing method comprises encapsulating by an encapsulation resin 4, a space part A including a light-receiving element 1 and a lead frame 3 which are arranged above a support medium 6 where the light-receiving element 1 and the lead frame 3 are integrally arranged on a surface; subsequently removing the support medium 6 by polishing; and forming a polished surface by polishing a surface of a light-incident surface 1a of the light-receiving element 1 exposed by the removal. |
