发明名称 |
SILVER PLATING MATERIAL |
摘要 |
<p>A silver plating material having a silver plating film having a thickness of no more than 10 µm formed upon a raw material comprising copper or a copper alloy. The arithmetic average roughness (Ra) of the surface of the silver plating film is no more than 0.1 µm, and the {111} orientation ratio of the silver plating film is at least 35%.</p> |
申请公布号 |
WO2013137121(A1) |
申请公布日期 |
2013.09.19 |
申请号 |
WO2013JP56380 |
申请日期 |
2013.03.01 |
申请人 |
DOWA METALTECH CO., LTD. |
发明人 |
SHINOHARA, KEISUKE;OGATA, MASAFUMI;MIYAZAWA, HIROSHI |
分类号 |
C25D7/00;H01H1/025;H01H1/04;H01R13/03 |
主分类号 |
C25D7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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