发明名称 |
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD |
摘要 |
A printed circuit board includes a substrate, at least one pad on the substrate, and permanent mold coatings capable of coating on the copper foil. Each pad includes a copper foil and a solder resist coating on the substrate and surrounding the copper foil. The copper foil defines an opening. The opening is coated with solder resist, whereby the permanent mold coatings form a recess corresponding to the opening when coated on the copper foil. A method for manufacturing a printed circuit board is also provided.
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申请公布号 |
US2013240254(A1) |
申请公布日期 |
2013.09.19 |
申请号 |
US201213563861 |
申请日期 |
2012.08.01 |
申请人 |
PENG XIAO-ZHAN;NIE QIANG;ZHANG CUI-CUI;ZHANG JUN-CUI;HON HAI PRECISION INDUSTRY CO., LTD.;HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD. |
发明人 |
PENG XIAO-ZHAN;NIE QIANG;ZHANG CUI-CUI;ZHANG JUN-CUI |
分类号 |
H05K1/09;H05K3/00 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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