发明名称 |
Packaging Methods, Material Dispensing Methods and Apparatuses, and Automated Measurement Systems |
摘要 |
Packaging methods, material dispensing methods and apparatuses, and automatic measurement systems are disclosed. In one embodiment, a method of packaging semiconductor devices includes coupling a second die to a top surface of a first die, dispensing a first amount of underfill material between the first die and the second die, and capturing an image of the underfill material. Based on the image captured, a second amount or no additional amount of underfill material is dispensed between the first die and the second die. |
申请公布号 |
US2013244346(A1) |
申请公布日期 |
2013.09.19 |
申请号 |
US201213420383 |
申请日期 |
2012.03.14 |
申请人 |
WANG CHIEN RHONE;LAI CHIH-WEI;CHANG CHIH-CHIANG;ZUO KEWEI;LIN JING-CHENG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
WANG CHIEN RHONE;LAI CHIH-WEI;CHANG CHIH-CHIANG;ZUO KEWEI;LIN JING-CHENG |
分类号 |
H01L21/66;G06F17/00 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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