发明名称 |
Heat sink interface having three-dimensional tolerance compensation |
摘要 |
A thermal interface includes a plurality of elevated regions and a plurality of mechanical tolerance circuits coupled to the plurality of elevated regions. The thermal interface is configured to be disposed between an array of heat generating elements and a heat sink with each of the plurality of elevated regions thermally coupled to a corresponding one or more of the array of heat generating elements. In one embodiment, the thermal interface provides a thermal path between a printed wiring board having a plurality of flip-chip circuit components disposed on an external surface thereof and a heat sink disposed over the flip-chip circuit components.
|
申请公布号 |
US8537552(B2) |
申请公布日期 |
2013.09.17 |
申请号 |
US20090566818 |
申请日期 |
2009.09.25 |
申请人 |
PAQUETTE JEFFREY;CHEYNE SCOTT R.;ELLSWORTH JOSEPH R.;MARTINEZ MICHAEL P.;TRAHAN MICHAEL R.;RAYTHEON COMPANY |
发明人 |
PAQUETTE JEFFREY;CHEYNE SCOTT R.;ELLSWORTH JOSEPH R.;MARTINEZ MICHAEL P.;TRAHAN MICHAEL R. |
分类号 |
H05K7/20;F28F7/00;H01Q11/00 |
主分类号 |
H05K7/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|