| 摘要 |
Manufacture of electronic devices is usually accomplished through automated assembly lines using automated conveyors. These automated conveyors, typically comprising metallic components, cannot convey electronic devices into an RF chamber for testing (e.g., RF) during manufacture without compromising the efficacy of the shielding provided by the RF chamber. Thus, although electronic devices are assembled on automated assembly lines, a device is typically removed from the automated assembly line for testing, transported manually into an RF chamber, powered on, and then tested. After testing, the electronic device is powered down, manually removed from the RF chamber, and returned to the assembly line. Described herein are embodiments of a system and method to automatically transport electronic devices under power through an RF isolated chamber for testing (e.g., RF) as part of an automated assembly line process resulting in a dramatic increase in the number of electronic devices that can be tested.
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