发明名称 LED PACKAGE
摘要 PURPOSE: An LED package is provided to reduce progressive cracks by arranging a blocking member between a conductive filling material and the boundary surface of a substrate. CONSTITUTION: A substrate includes a through hole. The through hole is filled with a conductive filling material (121). An LED device (14) is arranged on the substrate. A lens mold covers the through hole and the LED device. A blocking member (13) blocks a lens mold material.
申请公布号 KR20130101741(A) 申请公布日期 2013.09.16
申请号 KR20120022714 申请日期 2012.03.06
申请人 HANA MICRON INC. 发明人 SHIM, YOUNG SEOK
分类号 H01L33/48;H01L33/54 主分类号 H01L33/48
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