| 摘要 |
PROBLEM TO BE SOLVED: To provide a test module for a burn-in tester capable of assembling the burn-in tester by simple structure and manufacturing process, and the burn-in tester.SOLUTION: A test module for a burn-in tester includes: a tester substrate which is provided for interpreting a result signal to be fed back (Feedback) after applying a test signal to a semiconductor device loaded on one test board; a support frame on one side of which a board accommodation part for accommodating one test board on which the semiconductor device is loaded is provided, on the other side of which a substrate accommodation part in which the tester substrate is accommodated is provided, and which supports the tester substrate accommodated in the board accommodation part; and a connection substrate for electrically connecting the tester substrate with the semiconductor device loaded on one test board accommodated in the board accommodation part. |
