发明名称 |
IMPLEMENTING SELECTIVE REWORK FOR CHIP STACKS AND SILICON CARRIER ASSEMBLIES |
摘要 |
A method, apparatus, and structure are provided for implementing selective rework for chip stacks. A backside metal layer to create resistive heating is added to a chip backside in a chip stack. A rework tool applies a predefined current to the backside metal layer to reflow solder connections and enables separating selected chips in the chip stack.
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申请公布号 |
US2013233832(A1) |
申请公布日期 |
2013.09.12 |
申请号 |
US201313869658 |
申请日期 |
2013.04.24 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BARTLEY GERALD K.;BECKER DARRYL J.;GERMANN PHILIP R.;MAKI ANDREW B. |
分类号 |
B23K1/018;B23K3/047 |
主分类号 |
B23K1/018 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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