| 摘要 |
PROBLEM TO BE SOLVED: To provide a cover tape for packaging chip type electronic parts which can suppress static electricity generated upon friction or peeling of a cover tape, suppress the lowering of tape strength which is caused by width-narrowing of the cover tape or the lowering of transparency of the cover tape stored under a high temperature condition, and retain the peel-off strength within a proper range.SOLUTION: A cover tape for packaging chip type electronic parts, to be heat-sealed onto an embossed carrier tape having a housing pocket of chip type electronic parts, has a multilayer structure including: an antistatic layer 1 containing an antistatic agent; a substrate layer 2 of a biaxially stretched plastic film; an intermediate layer 4 made from polyethylene; an interlayer bonding layer 3 for bonding a substrate and the intermediate layer; and a seal layer 5 heat-sealed to the embossed carrier tape, wherein the seal layer is configured such that metal oxide conductive fine powder and spherical polymer fine particles are dispersed in a resin mixture of a thermoplastic elastomer resin, a tackifier resin, and an acrylic resin. |
