发明名称 CONNECTION STRUCTURE FOR ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a connection structure for electronic components, which has only one kind of bus bar and by which various kinds of electronic components having different pitches between their contact points, different outer shapes, and sizes can be connected.SOLUTION: A pair of bus bars 11 are arranged in parallel apart from each other in a housing 13, a terminal part 15a being formed at one end of each bus bar. At each terminal part 15a, a pair of first right and left contact spring pieces 51 and 53 are formed that have swollen parts 71 projecting out right and left on the side of tip end parts 51a and 53a that can contact to each other. Among the first right and left contact spring pieces 51 and 53 of the bus bars 11 arranged in parallel, the swollen parts 71 of two inner contact spring pieces that are adjacent to each other are respectively brought into flexible contact with a pair of contact point parts 23 of a light-emitting element arranged on both side surfaces 77 of a semiconductor light-emitting element 29 placed between the pair of bus bars 11. At the same time, among the first right and left contact spring pieces 51 and 53 of the bus bars 11 arranged in parallel, the swollen parts 71 of two outer contact spring pieces are brought into flexible contact with inner walls 73 of the housing 13.
申请公布号 JP2013182878(A) 申请公布日期 2013.09.12
申请号 JP20120048336 申请日期 2012.03.05
申请人 YAZAKI CORP 发明人 MOCHIZUKI SHINJI
分类号 H01R24/20;H01R33/05;H01R33/90;H01R33/945 主分类号 H01R24/20
代理机构 代理人
主权项
地址