| 摘要 |
PROBLEM TO BE SOLVED: To provide a bond fixing device capable of curing any component sufficiently at the same time even when the light absorption coefficient, heat capacity or the like of respective components are different, when bond fixing a plurality of components to a substrate with a thermosetting type adhesive using an infrared lamp.SOLUTION: By conducting irradiation of infrared lamp light through a mask equipped with a window for leading the infrared light to a member coated with a reactive adhesive, and a light intensity attenuator for controlling irradiated light intensity, the adhesive coated on any component can be cured sufficiently at the same time. |
