发明名称 |
METHOD FOR MOUNTING A COMPONENT IN OR ON A CIRCUIT BOARD, AND CIRCUIT BOARD |
摘要 |
In a method for mounting an element or component having at least one metal surface in or on a circuit board containing at least one conducting layer made of metal material, a connection between the at least one metal surface of the element and the at least one conducting layer of the circuit board is formed using ultrasonic welding or high-frequency friction welding in order to create a mechanically stable and resistant connection or attachment having good conductivity. Furthermore, a circuit board is disclosed in which at least one element or component having a metal surface is or can be connected to a conducting or conductive layer of the circuit board using ultrasonic welding or high-frequency friction welding.
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申请公布号 |
US2013233603(A1) |
申请公布日期 |
2013.09.12 |
申请号 |
US201113988385 |
申请日期 |
2011.11.16 |
申请人 |
WEICHSLBERGER GUENTHER;DROFENIK DIETMAR;AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT |
发明人 |
WEICHSLBERGER GUENTHER;DROFENIK DIETMAR |
分类号 |
H05K3/32;H05K1/18 |
主分类号 |
H05K3/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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