发明名称 BUMP TREATMENT DEVICE AND BUMP TREATMENT METHOD
摘要 PROBLEM TO BE SOLVED: To provide a bump treatment device and a bump treatment method capable of effectively reducing risk of rupture and reducing influence over the peripheral tissue by miniaturizing a bump.SOLUTION: A bump treatment device includes: a miniaturizing mechanism 14 for miniaturizing a bump 62; an elongated shaft 12 (a feeding part); and a detaching mechanism 16 for detachably connecting the shaft 12 and the miniaturizing mechanism 14. The miniaturizing mechanism 14 includes: a plurality of arms 22; and a plurality of engaging parts 24 respectively provided in the arms 22 and capable of engaging with the inner wall of the bump 62. The bump treatment device is configured to be moved from an expanded state with an extended space between the arms 22 to a contracted state with the narrowed space between the arms 22. The miniaturizing mechanism 14 is inserted into the bump 62 so that the arms 22 of the miniaturizing mechanism 14 are expanded, and the engaging parts 24 are engaged with the inner wall of the bump 62. The bump 62 is miniaturized by displacing the arms 22 inward in that state.
申请公布号 JP2013179963(A) 申请公布日期 2013.09.12
申请号 JP20120043735 申请日期 2012.02.29
申请人 TERUMO CORP 发明人
分类号 A61B17/12 主分类号 A61B17/12
代理机构 代理人
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