发明名称 |
Packaging Methods and Packaged Semiconductor Devices |
摘要 |
Packaging methods and packaged semiconductor devices are disclosed. In one embodiment, a packaging method includes providing a first die, partially packaging the first die, and forming a plurality of solder balls on a surface of the partially packaged first die. An epoxy flux is disposed over the plurality of solder balls. A second die is provided, and the second die is partially packaged. The plurality of solder balls is coupled to the partially packaged second die.
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申请公布号 |
US2013234317(A1) |
申请公布日期 |
2013.09.12 |
申请号 |
US201213416805 |
申请日期 |
2012.03.09 |
申请人 |
CHEN MENG-TSE;LIN WEI-HUNG;TSAI YU-PENG;LIN CHUN-CHENG;LIN CHIH-WEI;CHENG MING-DA;LIU CHUNG-SHI;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHEN MENG-TSE;LIN WEI-HUNG;TSAI YU-PENG;LIN CHUN-CHENG;LIN CHIH-WEI;CHENG MING-DA;LIU CHUNG-SHI |
分类号 |
H01L25/07;H01L21/60 |
主分类号 |
H01L25/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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