发明名称 |
MODULE WITH EMBEDDED ELECTRONIC COMPONENTS, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING MODULE WITH EMBEDDED ELECTRONIC COMPONENTS |
摘要 |
<p>[Problem] To provide a module with embedded electronic components, wherein a wiring substrate on which electronic components are mounted is resin-sealed, and with which mounting is possible in a small space. [Solution] A module with embedded electronic components, comprising: a wiring substrate (110), comprising a substrate and wiring formed on a portion of the substrate; electronic components (120) mounted on the wiring substrate (110); and resin (130) that resin-seals the electronic components (120) together with a portion of the wiring substrate. On one surface of the wiring substrate (110) there is at least a resin-sealed region (201), which is sealed with the resin (130), and a non-resin-sealed region (202), which is not sealed with the resin (130), and when viewed from the other surface of the wiring substrate, at least a portion of the boundary (203) between the resin-sealed region (201) and the non-resin-sealed region (202) is inside of the outer edge of the resin that seals the resin-sealed region (201).</p> |
申请公布号 |
WO2013132815(A1) |
申请公布日期 |
2013.09.12 |
申请号 |
WO2013JP01293 |
申请日期 |
2013.03.04 |
申请人 |
NEC CORPORATION;NISHIMURA, NOZOMU;MIKAMI, NOBUHIRO |
发明人 |
NISHIMURA, NOZOMU;MIKAMI, NOBUHIRO |
分类号 |
H05K3/28;H01L25/04;H01L25/18;H05K1/02 |
主分类号 |
H05K3/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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