| 摘要 |
<p>An aim of the invention is to provide a substrate for carrying semiconductor components and a manufacturing method thereof. Even the substrate for carrying the semiconductor components is in transportation, the damage for a clad layer, which is caused by transportation, etc., can be prevented. The substrate for carrying the semiconductor components is the substrate (50) which is provided with clad layers (20,21) with a preset shape on two surfaces of a metal plate (10). The substrate for carrying the semiconductor components is characterized in that: each clad layer comprises a protection clay layer (20); and the protection clad layer is formed in a dent part (12) which is formed on the surface of the metal plate with a thickness that is smaller than the depth of the dent part.</p> |
