THE PRINTED CIRCUIT BOARD MANUFACTURING METHOD

摘要

PURPOSE: A protection method for an inner circuit of a printed circuit board is provided to enable shielding with one ink application and prevent liquid from permeating into a circuit in a liquid process in which cohesive power is increased and coated afterward by processing thermal compression bonding after the printing of peelable ink. CONSTITUTION: A protection method for an inner circuit of a printed circuit board comprises a step (S10) of forming a circuit on an inner layer forming the circuit on the upper part of a copper substrate of a raw material state; a step (S20) of laminating a coverlay on the upper part of the inner layer; a step (S30) of laminating an outer layer on the upper surface by using a hot press; a step (S40) of printing a peelable ink in order to prevent the circuit of the inner layer exposed to the outside; a step (S50) of performing copper plating between the laminated inner layer and the outer layer to comprise electrical connection; a step (S60) of forming an outer layer circuit forming the circuit on the laminated outer layer; and a step (S70) of removing the peelable ink printed on the upper part of the inner layer circuit. [Reference numerals] (AA) Start; (BB) End; (S10) Step of forming a circuit on an inner layer; (S20) Step of preparing a coverlay; (S30) Step of laminating an outer layer; (S40) Step of printing a peelable ink; (S50) Step of performing copper plating; (S60) Step of forming an outer layer circuit; (S70) Step of removing the peelable ink