| 摘要 |
To provide a package for storing electronic component elements, said package making it is possible to guarantee the bending strength of a ceramic substrate and the metalized joint strength of the metal layer. [Solution] A package (10) for storing electronic component elements, said package comprising a ceramic substrate (11) and a metal layer (12), wherein the package for storing electronic component elements is characterized in that: the ceramic substrate (11) contains 10 to 30 wt% of partially-stabilized zirconia by forming solid solution with yttria and 1.5 to 4.5 wt% of a sintering auxiliary agent formed from a combination of magnesia and at least one selected from silica, calcia, and manganese oxide, with the balance being alumina; the metal layer (12) contains 70 to 94 wt% of tungsten, 3 to 20 wt% of molybdenum, and 3 to 20 wt% of a ceramic component; and at least 60% of zirconia crystals in the ceramic substrate (11) after co-firing is in tetragonal phase. |
