| 摘要 |
PURPOSE: A method for debonding a device wafer is provided to improve production yield of the device wafer by separating the device wafer from a temporary bonding adhesive layer which connects a carrier wafer and the device wafer without damage. CONSTITUTION: A carrier wafer(10), an adhesive layer(20), a protection film layer(30), and a device wafer(40) are successively laminated on the upper side of a dicing frame(60). The dicing frame is loaded on a sliding table(400). Heat is generated in the adhesive layer by applying a microwave to the adhesive layer. The carrier wafer is physically separated from the device wafer. The protection film layer is peel off from the device wafer. |
