| 摘要 |
The invention pertains to a method for manufacturing a microelectronic device on a substrate comprising at least one first electrical component and one second electrical component distributed respectively in first and second levels stacked one on top of the other on the substrate, this method comprising: the manufacture of at least one first arm and one second arm of different lengths, each of these arms directly and mechanically linking an electrical pad to a fixed anchoring point on the substrate, and the electrical pad is made inside the first level and then shifted, prior to the electrical connection of the second component, to a position of connection wherein the upper face of the electrical pad is in contact with the interior of the second level parallel to the substrate.
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