发明名称 MECHANICAL LAYER OF AN ELECTROMECHANICAL DEVICE AND METHODS OF FORMING THE SAME
摘要 This disclosure provides mechanical layers and methods of forming the same. In one aspect, an electromechanical systems device includes a substrate and a mechanical layer having an actuated position and a relaxed position. The mechanical layer is spaced from the substrate to define a collapsible gap. The gap is in a collapsed condition when the mechanical layer is in the actuated position and in a non-collapsed condition when the mechanical layer is in the relaxed position. The mechanical layer includes a reflective layer, a conductive layer, and a supporting layer. The supporting layer is positioned between the reflective layer and the conductive layer and is configured to support the mechanical layer.
申请公布号 KR20130100232(A) 申请公布日期 2013.09.10
申请号 KR20127029146 申请日期 2011.04.01
申请人 QUALCOMM MEMS TECHNOLOGIES, INC. 发明人 TAO YI;ZHONG FAN;DE GROOT WILHELMUS A.
分类号 G02B26/00;B81B3/00 主分类号 G02B26/00
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