发明名称 Integration of non-noble DRAM electrode
摘要 A method for forming a capacitor stack is described. In some embodiments of the present invention, a first electrode structure is comprised of multiple materials. A first material is formed above the substrate. A portion of the first material is etched. A second material is formed above the first material. A portion of the second material is etched. Optionally, the first electrode structure receives an anneal treatment. A dielectric material is formed above the first electrode structure. Optionally, the dielectric material receives an anneal treatment. A second electrode material is formed above the dielectric material. Typically, the capacitor stack receives an anneal treatment.
申请公布号 US8530348(B1) 申请公布日期 2013.09.10
申请号 US201213482573 申请日期 2012.05.29
申请人 MALHOTRA SANDRA G.;CHEN HANHONG;DEWEERD WIM Y.;HAYWOOD EDWARD L.;ODE HIROYUKI;RICHARDSON GERALD;INTERMOLECULAR, INC.;ELPIDA MEMORY, INC. 发明人 MALHOTRA SANDRA G.;CHEN HANHONG;DEWEERD WIM Y.;HAYWOOD EDWARD L.;ODE HIROYUKI;RICHARDSON GERALD
分类号 H01L21/4763 主分类号 H01L21/4763
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