| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component module which enables the thickness reduction and the downsizing, and to provide a manufacturing method of the electronic component module.SOLUTION: An electronic component module seals components mounted on a front surface and a rear surface of a double sided mounting substrate with an insulative resin. The rear surface of the double sided mounting substrate is sealed so that a lead frame joined to the rear surface is exposed from the insulative resin. A thickness of the insulative resin sealing the component mounted on the rear surface of the double sided mounting substrate is equal to or less than a thickness of the lead frame. |
