| 摘要 |
PROBLEM TO BE SOLVED: To provide a pattern forming apparatus capable of improving manufacturing yield and a method of manufacturing a semiconductor device.SOLUTION: The pattern forming apparatus according to an embodiment is a pattern forming apparatus which uses a template including a base material having a side surface and a pattern provided to the base material and having a shape of at least one of a concave portion and a convex portion, and which transfers the form of the pattern onto resin on a substrate. The pattern forming apparatus is equipped with a holding section, a stage, a drive section, and a hardening section. The holding section includes a contact section which contacts the template, and holds the template. The substrate is mounted on the stage mounts. The drive section moves at least one of the holding section and the stage to make the pattern contact the resin. The hardening section hardens the resin. The contact section includes a main body part which moves forward/backward with respect to the template, and a tip portion provided to the main body part. The tip portion has a plurality of protruded portions which are provided apart from each other and each of which has a contact surface contacting the side surface. |
