| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem in which there are many cases in which a component and a substrate bend to opposite directions and a mounting failure (a solder opening) in a vicinity of a central part of a component having a large total sum of warpage values occurs.SOLUTION: The substrate is mounted with a component provided with a plurality of terminals. A wiring pattern of the substrate mounted with the component is arranged for each of a plurality of terminals of the component, and a size of a wiring pattern for a terminal in a vicinity of a central part of the component is smaller than a size of a wiring pattern for a terminal in a vicinity of an end part of the component. |
