| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminate wiring film for electronic component using a coating layer which can ensure adhesion to a substrate as a ground layer required for the coating layer, or heat resistance as an upper layer (cap film) for protecting the surface of Cu in a main conductive layer, in the laminate wiring film having a main conductive layer of Cu, and can maintain a low electric resistance value even after a heating process.SOLUTION: The laminate wiring film for electronic component having a metal layer formed on a substrate consists of a main conductive layer containing Cu as a main component, and a coating layer covering at least one surface of the main conductive layer. The coating layer is a Cu alloy having a composition formula represented by Cu-Al, 20≤X≤60 in atomic ratio, and the remainder is inevitable impurities. |
