发明名称 CONDUCTIVE POWDER PLATED BY ELECTROLESS PLATING AND PROCESS FOR PRODUCING THE SAME
摘要 A conductive powder plated by electroless plating which, even when composed of fine particles having an average particle diameter of, in particular, 20 µm or smaller, has excellent deposit adhesion imparted thereto without using chromic acid, which is causative of environmental pollution, permanganic acid, etc.; and a process for industrially advantageously producing the powder. The conductive powder plated by electroless plating is characterized by comprising a core powder coated with a melamine resin and a metallic coating film deposited thereon by electroless plating.The process is characterized by comprising: a step in which a core powder is brought into contact with an initial condensate for a melamine resin and the initial condensate is polymerized to obtain a core powder coated with a melamine resin; a step in which a noble metal is deposited on the surface of the core powder coated with the melamine resin; and a step in which the core powder having the noble metal deposited thereon is plated by electroless plating.
申请公布号 KR101305574(B1) 申请公布日期 2013.09.09
申请号 KR20087023517 申请日期 2007.03.19
申请人 发明人
分类号 C23C18/54;C23C28/00 主分类号 C23C18/54
代理机构 代理人
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