| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrolytic hard gold plating liquid capable of suppressing deposition of gold on a part which requires no gold plating film while forming a gold plating film only on a part requiring the film, and superior in stability.SOLUTION: An electrolytic hard gold plating liquid includes a gold cyanide salt, a conductive salt of an organic acid, a chelating agent, iron ions, and at least one of a boric acid and a borate salt. A plating method is a method for plating using the electrolytic hard gold plating liquid, and includes a step where the part which requires no plating of a connector material is shielded, and a step where the electrolytic hard gold plating liquid is sprayed to a contact part of the connector material partially shielded, for partially plating. In this manufacturing method of gold-iron alloy film, a gold-iron alloy film is deposited on an object to be plated, through electroplating using the electrolytic hard gold plating liquid. |
