| 摘要 |
PROBLEM TO BE SOLVED: To provide a board capable of maintaining stable mounting conditions on a mounting member and restraining deformation, and a lighting fixture using the board.SOLUTION: Via holes 4v, ... are formed by applying copper plating treatment to through-holes for penetrating from a non-conductive layer (heat conductive layer) 41b of a wiring pattern layer 41 to a heat radiation layer 42. The via holes 4v, ... do not electrically connect front and back layers of the board 4, namely, the non-conductive layer (heat conductive layer) 41b and the heat radiation layer 42, but is connected in a thermal conduction state for heat radiation and heat equalization. |
