发明名称 COPPER FOIL WITH ATTACHED CARRIER FOIL, METHOD FOR MANUFACTURING COPPER FOIL WITH ATTACHED CARRIER FOIL, AND COPPER CLAD LAMINATE BOARD FOR LASER BEAM DRILLLING OBTAINED BY USING COPPER FOIL WITH ATTACHED CARRIER FOIL
摘要 The purpose of the present invention is to improve processing performance in laser beam drilling a copper clad laminate board, a blackening treated surface of said copper clad laminate board being to be used as a treatment surface in the laser beam drilling. To achieve this purpose, a copper foil (1) with attached carrier foil is provided, said copper foil (1) with attached carrier foil having a layered structure consisting of a carrier foil (2)/a release layer (3)/a bulk copper layer (4) and being characterized in that metal component-containing grains (5) are disposed between the release layer (3) and the bulk copper layer (4). When a copper clad laminate board is manufactured by using this copper foil with attached carrier foil, a blackening treated layer with a color that ensures excellent laser beam drilling performance can be formed on the surface of the bulk copper layer.
申请公布号 WO2013129508(A1) 申请公布日期 2013.09.06
申请号 WO2013JP55208 申请日期 2013.02.27
申请人 MITSUI MINING & SMELTING CO., LTD. 发明人 YOSHIKAWA, KAZUHIRO
分类号 C25D1/04;B32B7/06;B32B15/04;C25D7/06;C25D15/00;H05K1/09;H05K3/00 主分类号 C25D1/04
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