发明名称 PLASMA BOURNDRY LIMITER UNIT, APPARATUS AND METHOD FOR TREATING A SUBSTRATE
摘要 PURPOSE: A plasma boundary limiting unit and a substrate processing apparatus are provided to smoothly exhaust a discharge space of gases by supplying a plurality of plates in the longitudinal direction of a ring body. CONSTITUTION: A processing chamber (100) has a door assembly (140) to open or close an opening part. A support unit (200) is installed in the processing chamber and supports a substrate. A gas supply unit (300) supplies a process gas to the processing chamber. A plasma generating unit (400) generates plasma from the processing gas. A plasma boundary limiting unit (500) surrounds a discharge space located on the upper side of the support unit in the processing chamber. The plasma boundary limiting unit minimizes the plasma outputted from the discharge space.
申请公布号 KR20130099776(A) 申请公布日期 2013.09.06
申请号 KR20120050235 申请日期 2012.05.11
申请人 SEMES CO., LTD. 发明人 KOO, IL GYO;SHIM HYUN JONG
分类号 H01L21/205;H01L21/3065 主分类号 H01L21/205
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