MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THEREOF

摘要

PURPOSE: A multilayered printed circuit board and a manufacturing method thereof are provided to enhance components per a circuit pattern, to enable high density installation, and to obtain the reliability of the operation of an electronic device. CONSTITUTION: A multilayered printed circuit board includes a substrate (1); a first copper foil pattern (2) formed on the substrate; an epoxy resin layer (3) which is formed on the substrate in order to cover the first copper foil pattern and formed by epoxy resin printing on a region except for a land hole for the electrical connection to the upper part on the first copper foil pattern; a conductive paste (4) formed inside the land hole by printing; and a second copper foil pattern (5) formed on the epoxy resin layer to be connected to the conductive paste.