HETEROSTRUCTURE FOR COOLING AND METHOD OF FABRICATING THE SAME

摘要

PURPOSE: A heterojunction cooling structure and a manufacturing method thereof are provided to allow the same to endure high and wide temperature cycle environment by brazing-welding a first unit which includes ceramics and a second unit which includes carbons. CONSTITUTION: A heterojunction cooling structure comprises a first unit (410) and a second unit (204). The first unit includes ceramics, and a substrate is settled on the first unit. The second unit includes carbons and is brazing-welded with the first unit, and cooling channels (162) in which fluid which cools the substrate is flowed. The second unit includes a hybrid complex which includes carbons. The hybrid complex includes a body part and a canning part (144). The body part includes carbons, and the cooling channel is embedded. The canning part includes aluminum and surrounds the external surface of the body part. A manufacturing method of the heterojunction heat-release structure comprises the following steps: preparing the first unit which includes ceramics; forming the second unit which includes carbons and the cooling channel is embedded; and brazing-welding the first unit and the second unit.