MANUFACTURING METHOD OF ELECTRONIC COMPONENT AND WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component which enables a test of a first chip to be conducted after mounting the first chip and before mounting a second chip.SOLUTION: After a logic chip 90A is mounted on a first mounting pad 158A to conduct a function test of the logic chip 90A through a test pad 158T (Fig. 4(A)), a memory chip 90B is mounted on a second mounting pad 158B (Fig. 4(B)). The manufacturing method allows the test of the logic chip to be easily conducted before the memory chip is attached. Thus, when the logic chip does not function, the attachment of the memory chip may be cancelled and the wasteful use of the memory chip is avoided.